wafer.space Community - Shared die / multi-project dice

I’m only loosely thinking about this at the moment, as part of a personal interest/learning project. As such I don’t have much budget. Here are some initial thoughts though…

maybe 1mm2 area
Up to 30 digital IOs (or some mix of I, O, and IO)
probably 4 analog pins
I need bonding… COB or packaged parts
caravel is optional for me

@Essen this was meant to be a reply to you, sorry

No worries.

Nice, thanks for the list. Let's see if we can get a few more people on board to help bring the cost down.

Here are my initial thoughts :

~1mm2 area
6 pins : 4 digital ( 1 IO, 2 I, 1 O), 1 power, 1 gnd

13:14

I would also need bonding, but am willing to take care of organizing and coordinating it ( have never done it )